From bare boards to fully assembled, tested and boxed products — one accountable partner from your first schematic to volume production.
Capabilities aligned with mid-sized factory best practice. Contact us for a full capability statement.
| Process | Our Capability | Notes |
|---|---|---|
| PCB layers | 2–32 layers | HDI, rigid-flex, metal-core |
| Min line width / spacing | 3 mil / 3 mil | Impedance-controlled on request (±5%) |
| Max board size | 600 × 900 mm | Panelized for cost efficiency |
| Surface finish | ENIG, OSP, Immersion Ag/Au, HASL-LF | RoHS compliant |
| Board material | FR-4, Rogers, polyimide, aluminum | Halogen-free options |
| Min component | 01005 (0402 metric) | BGA/QFN/CSP down to 0.4 mm pitch |
| SMT lines | High-volume automated SMT lines | Inline AOI on every line |
| Assembly types | SMT + THT mixed | Qualified hand-soldering for through-hole |
Every service is delivered by the same quality system — no subcontracting of critical steps.
Panel-ready stack-ups sized up to 600 × 900 mm across FR-4, Rogers, polyimide and aluminum — with halogen-free options when your spec requires it.
High-volume automated SMT lines placing 01005 (0402 metric) parts and fine-pitch ball-grid arrays down to 0.4 mm pitch, with mixed SMT + THT assembly.
From bare board and BOM to a finished, packed product — mechanical mounting, harness routing and final configuration handled by one in-house team.
BOM-level procurement that plans around long-lead and end-of-life parts, so a missing reference never stalls your build.
A defined inspection chain from solder paste to finished unit — automated optical checks, ball-joint X-ray and electrical test before shipment.
Fast prototype turnaround with free DFM/DFA feedback on your Gerbers and BOM before you commit to production volumes.
Attach your Gerber files and BOM. Our DFM team reviews them and comes back with the best route to manufacturing, free of charge.