From bare boards to fully assembled, tested and boxed products — one accountable partner from your first schematic to volume production.
Capabilities aligned with mid-sized factory best practice. Contact us for a full capability statement.
| Process | Our Capability | Notes |
|---|---|---|
| PCB layers | 2–32 layers | HDI, rigid-flex, metal-core |
| Min line width / spacing | 3 mil / 3 mil | Impedance-controlled on request (±5%) |
| Max board size | 600 × 900 mm | Panelized for cost efficiency |
| Surface finish | ENIG, OSP, Immersion Ag/Au, HASL-LF | RoHS compliant |
| Board material | FR-4, Rogers, polyimide, aluminum | Halogen-free options |
| Min component | 01005 (0402 metric) | BGA/QFN/CSP down to 0.4 mm pitch |
| SMT lines | 12 automated lines | Inline AOI on every line |
| Assembly types | SMT + THT mixed | Qualified hand-soldering for through-hole |
Every service is delivered by the same quality system — no subcontracting of critical steps.
High-multilayer boards with tight impedance control for FR-4, HDI, metal-core & flexible materials.
Fully automated SMT lines with 01005 micro-components and fine-pitch BGA for repeatable quality.
Complete product assembly — wiring harness, housing, final integration and packing, ready to ship.
Genuine, traceable parts sourced through long-term partnerships with authorized distributors.
Multi-stage inspection from incoming to out-going: SPI, AOI, X-ray, ICT and functional test.
Fast 48-hour prototype turnaround and NPI support — free DFM feedback before you commit to volume.
Attach your Gerber files and BOM. Our DFM team reviews them and comes back with the best route to manufacturing, free of charge.